Enosemi presents on optical chiplets at the 2024 OCP-JEDEC workshop on 3D IC packaging

Enosemi’s VP of Engineering, Shahab Ardalan, discusses the benefits of optical chiplets at the 2024 3DIC workshop jointly hosted by the Open Compute Project and JEDEC. The goal of the workshop was to “identify standards that, if developed, can simplify chiplet/3DIC design from specification and tapeout to chip packaging.” Optical chiplets will become an important part of the future chiplet ecosystem as electronic systems scale to higher bandwidths and require advanced integrated optical functionalities.

Watch the full video here